Tin Silver Copper Target

Part Name：Tin Silver Copper Target

Material：SAC

Specifications：Ø203.2 x 3mm Thickness (customized) (Option: Target Bonded to Backing Plate)

Purity：99.99%

Common Applications：Semiconductor, Wafer & Chip, Microelectronic Senser, Aerospace, 5G Photoelectricity, Functional Coating